Product description
Parker Chomerics CHO-BOND primers 1085
and 1086 are air-drying liquid coatings used
to improve the adhesion of Parker Chomerics
CHO-BOND conductive silicone compounds
to metal and other non-silicone substrates.
The primers are moisture reactive and
clear in color. CHO-BOND 1085 primer is
formulated to achieve maximum adhesion
on non-silicone substrates for CHO-BOND
1029 adhesive. CHO-BOND 1086 primer
is formulated for use with CHO-BOND
1016,1030, 1035, 1038, 1075 electrically
conductive adhesives/sealants and CHOTHERM®
1641 thermal compound.
