Product description
E-SOLDER® epoxy based resin systems can be used at room temperature on heat sensitive materials, can bond dissimilar materials, and do not have flux or residue to contaminate sensitive electronic components.
- Tensile Strength, Ultimate, butt tensile strength per ASTM D426 on brass
- Adhesive Bond Strength, Tensile shear per ASTM D1002 on etched Al panel
- Electrical Resistivity, cured 24 hr at 25°C (77°F). Value is 0.003 Ohm-cm cured 3 hr at 65°C (150°F)
- Maximum Service Temperature, Air
- Processing Temperature, Suggested time at this temperature is 24 hr. May also be cured for shorter time at higher temperatures.
